Work

Thermal analysis of a novel fan-out packaging structure optimized with graphene

Year: 2025

Type: article

Source: Engineering Research Express

DOI: 10.1088/2631-8695/ade4f1

Authors: Zhiyuan Wu, Zehui Dai, Guo Ye, Jinsong Peng, Zhenzhi He, Xiangning Lu

Institution: Jiangsu Normal University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Jiangsu Province

Awards: G7969442589, G988679790

OpenAlex ID: W4411331184

FWCI:

Cites: 30

Cited by:

Related to: 10