Work

Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias

Year: 2025

Type: article

Source: New Journal of Chemistry

DOI: 10.1039/d5nj02092a

Authors: Yaqiang Li, Xuesong Peng, Ruopeng Li, Jie Jiang, Fan Meng, Youzheng Wu, Changsheng Cao, Guangzhao Wang, Penghui Ren, Hao Xu, Maozhong An

Institutions: Harbin Institute of Technology, Fuzhou University, Yangtze Normal University, Inner Mongolia University of Technology

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Shandong Province, Inner Mongolia University of Technology

Awards: G3560008328, G4626702089, G612777148

OpenAlex ID: W4411379917

FWCI: 0.453

Cites: 41

Cited by: 2

Related to: 10