Work

Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2024-0070

Authors: Calvin Ling, Aizat Abas, Cheng Kai Chew, Muhammad Taufik Azahari

Institution: Universiti Sains Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411397043

FWCI:

Cites: 23

Cited by:

Related to: 10