Work

Development and Prospect of TSV-Based 3D Inductors

Year: 2025

Type: conference-paper

DOI: 10.1109/eeice65049.2025.11034304

Authors: Weihua Fan, Guoliang Li, Guangbao Shan

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

OpenAlex ID: W4411409166

FWCI: 2.358

Cites: 33

Cited by: 1

Related to: 10