Work

Analysis on the Bonding-wire Failure Mechanisms of Si/SiC Hybrid Switch under UIS Test

Year: 2025

Type: conference-paper

Source: International Conference on Energy, Electrical and Power Engineering (CEEPE)

DOI: 10.1109/ceepe64987.2025.11034067

Authors: Xueyi Gong, Hangzhi Liu, Yuming Zhou, Qipei Xu, Xiaopeng Dai, Biao Yang

Institution: Anhui University of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Anhui University

OpenAlex ID: W4411409214

FWCI:

Cites: 16

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Related to: 10