Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces
Year: 2025
Type: article
Source: Advanced Materials Technologies
Authors: Hakyung Jeong, Seungjin Oh, Hyunkyu Moon, Seungman Kim, Seongheum Han, Jun‐Yeob Song, Ah‐Young Park, Seung Moo Jeon, Chung Woo Lee, Jae Hak Lee
Institutions: Korea Institute of Machinery & Materials, University of Seoul
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G328295389, G3697248264
OpenAlex ID: W4411421145