Work

Numerical Simulation on Heat Dissipation Characteristics of Electronic Components with Different Heat Sink Arrangements in High-Performance Server

Year: 2025

Type: article

Abstract: As the integration of electronic components in high-performance servers increases, heat generation significantly impacts performance and raises failure rates. Therefore, heat dissipation has become a critical concern in elect... | Find, read and cite all the research you need on Tech Science Press

Source: Frontiers in Heat and Mass Transfer

DOI: 10.32604/fhmt.2025.065936

Authors: Zerui Chen, Xin Wu, Houpeng Hu, Yang Zhou, Shang Yang

Institution: Guizhou Power Grid Co., Ltd. (China)

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $275

Funder: China Southern Power Grid