Work

Designing Silver Conductive Ink S-Curve Interconnects for Bio-potential Monitoring E-Textiles Via Material Deposition Fabrication

Year: 2025

Type: conference-paper

Source: IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops)

DOI: 10.1109/percomworkshops65533.2025.00133

Authors: Sonya Patel, Vlad Porcila, Alfonso Miguel Alvaran, Jeremy Nugara, Ahsan Abdullah, Adriana Ieraci, Sharon Gabison, Jane Batt, Alireza Sadeghian, Maryam Davoudpour

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Natural Sciences and Engineering Research Council of Canada

OpenAlex ID: W4411447281

FWCI:

Cites: 33

Cited by:

Related to: 10