Work

Fabrication of a Silicon Carbide Probe Card with Through-Wafer Vias

Year: 2025

Type: conference-paper

Source: Intermountain Engineering, Technology and Computing (IETC)

DOI: 10.1109/ietc64455.2025.11039351

Authors: Andrew Hafener, Noah Johnson, Dillon Jensen, Gregory N. Nielson, Stephen Schultz

Institution: Brigham Young University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411484476

FWCI:

Cites: 13

Cited by:

Related to: 10