Underlying Thinning Mechanisms of Cu/Amorphous SiO2 Heterostructure in Through Glass Via Wafer from an Atomic Perspective
Year: 2025
Type: article
Authors: Kezhong Xu, Yuqi Zhou, Yuxin Chen, Jianguo Xie, Yuhan Gao, Fulong Zhu
Institution: Huazhong University of Science and Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G4248319452, G981922341
OpenAlex ID: W4411573044