Year: 2025
Type: article
Abstract: Modern computer architecture is heavily dependent on advanced packaging technologies. As Moore's Law begins to decline, semiconductor manufacturers will continue performance scaling by means of innovations in packaging. However, technologies to implement 2.5D, 3D integration, Fan-Out Wafer Level Packaging (FOWLP), and chiplet architecture all contain distinct performance, power efficiency, and integra tion density advantages. This paper analytically studies the methodologies of emerging advanced packaging technologies and their impact on modern computing paradigms. This paper presents a comparative study that illustrates how these technologies can reduce the form factor and consume less power while improving computing performance. Key applications, namely data centers, HPC, and Edge Computing, are discussed. We finally discuss the current challenges, what the prospects might be, and what may be the potential breakthroughs to advanced semiconductor packaging
Author: Shivakumar Udkar
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4411575806