Work

Metrology of silicon wafers under thermal and mechanical stress

Year: 2025

Type: article

Source: Metallurgical Research & Technology

DOI: 10.1051/metal/2025045

Authors: Ming-Lang Tseng, Nima E. Gorji

Institutions: Asia University, China Medical University, China Medical University Hospital, Technological University Dublin

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Irish Research Council

OpenAlex ID: W4411612280

FWCI: 0.231

Cites: 22

Cited by: 1

Related to: 10