Work

Coating Thickness in Hot Dip Tinning of Copper Wire by POIn-52 Solder

Year: 2025

Type: article

Source: Russian Engineering Research

DOI: 10.3103/s1068798x25700649

Authors: A. O. Pat’yanova, M. V. Kuz’min, V. L. Semenov, E. A. Mikishanina

Institution: Chuvash State University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411674925

FWCI:

Cites: 6

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Related to: 10