Work

Extraction of DK glass and DK resin for PCB Striplines and Analysis of Far-End Crosstalk

Year: 2025

Type: article

Source: IEEE Transactions on Signal and Power Integrity

DOI: 10.1109/tsipi.2025.3583657

Authors: Junyong Park, Yuandong Guo, Xiaoning Ye, DongHyun Kim

Institutions: Kyung Hee University, Dankook University, Advanced Micro Devices (United States), Intel (United States), Missouri University of Science and Technology

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Science Foundation

Award: Phase III IUCRC at Missouri University of Science and Technology: Center for Electromagnetic Compatibility

OpenAlex ID: W4411687997

FWCI:

Cites: 15

Cited by:

Related to: 10