Work

A 0.36 mm2 On-the-Fly I2C-to-SPI Converter for E-Textile Applications

Year: 2025

Type: conference-paper

Source: IEEE International Symposium on Circuits and Systems proceedings

DOI: 10.1109/iscas56072.2025.11043981

Authors: Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Daniel S. Truesdell, Benton H. Calhoun

Institution: University of Virginia

Language: English

Topic: Analog and Mixed-Signal Circuit Design

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Office of the Director, Intelligence Advanced Research Projects Activity

OpenAlex ID: W4411725377

FWCI: 2.903

Cites: 4

Cited by: 1

Related to: 10