Work

Scaling Co-Packaged Optical Interconnects Using Hybrid 2.5D/3D Integration

Year: 2025

Type: conference-paper

Source: IEEE International Symposium on Circuits and Systems proceedings

DOI: 10.1109/iscas56072.2025.11043946

Authors: Austin Rovinski, Yanghui Ou, Christine Ou, Devesh Khilwani, Yuyang Wang, Songli Wang, Sunwoo Lee, Keren Bergman, Alyosha Molnar, Christopher Batten

Institutions: Cornell University, Columbia University, Nanyang Technological University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4411725519

FWCI: 13.76

Cites: 25

Cited by: 6

Related to: 10