Work

Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS Pumping Applications

Year: 2025

Type: conference-paper

Source: IEEE International Symposium on Circuits and Systems proceedings

DOI: 10.1109/iscas56072.2025.11043309

Authors: Jacob Dawes, Alyssa Estenson, Louis Marun, George Corrigan, Alexander Govyadinov, Anand Jebakumar, Pavel Kornilovich, Erik Torniainen, Matthew L. Johnston

Institutions: Oregon State University, Hewlett-Packard (United States)

Language: English

Topic: Microfluidic and Capillary Electrophoresis Applications

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411725787

FWCI: 5.698

Cites: 37

Cited by: 2

Related to: 10