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A revisit on the Reliability Test for Conductive Anodic Filament failure for Printed Circuit Boards in High Humidity

Year: 2025

Type: conference-paper

Source: International Conference on Recent Advances in Electrical, Electronics, Ubiquitous Communication, and Computational Intelligence (RAEEUCCI)

DOI: 10.1109/raeeucci63961.2025.11048256

Authors: Debraj Banerjee, Cher Ming Tan, Rajarshi Sarkar, Weichun WC Huang, Dennis YT Cheng, Emily HI Chen

Institution: Chang Gung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411726235

FWCI:

Cites: 11

Cited by:

Related to: 10