Year: 2025
Type: article
Source: Journal of Inorganic Materials
DOI: 10.15541/jim20250241
Authors: Yixin ZHU, Zhikui YU, Qing WAN
Institution: Yongjiang Laboratory
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4411740384