Analysis of factors influencing the thermal characteristics of multichip parallel packaging in power devices
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3066805
Authors: Lei Wang, Rui Jin, Jianfang Xie, Wenyuan Li, Bo Zhao
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4411789319