Work

The Press Pack Packaging for Power IGBTs With Extremely High Current and Thermal Performance

Year: 2025

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2025.3584644

Authors: Erping Deng, Hongyu Sun, Yuan Sun, Lixin Wu, Yan Zhong, Maoyang Pan, Yuxing Yan, Yongzhang Huang

Institutions: Hefei University of Technology, North China Electric Power University, State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, State Grid Corporation of China (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4411799067

FWCI: 1.617

Cites: 30

Cited by: 7

Related to: 10