Work

Benefits of Using High-Resistivity Substrates for RF ICs

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11041609

Authors: Xunyu Li, Cesar Roda Neve, Ionut Radu, Albert Wang

Institutions: University of California, Riverside, Soitec (France)

Language: English

Topic: Radio Frequency Integrated Circuit Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411799133

FWCI: 2.277

Cites: 4

Cited by: 1

Related to: 10