Work

Effect of Cu Microstructures on Cu/SiO2 Hybrid Bonding for 3D IC Heterogeneous Integration

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11040297

Authors: Chih Chen, Huai-En Lin, Wei-Lan Chiu, Hsiang-Hung Chang

Institutions: National Yang Ming Chiao Tung University, Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411799149

FWCI: 2.358

Cites: 13

Cited by: 1

Related to: 10