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Advancing Emerging Device and Architecture Innovations in the AI Era

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11040992

Author: Ming Liu

Institution: Fudan University

Language: English

Topic: Advanced Memory and Neural Computing

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

Award: G8503923709

OpenAlex ID: W4411799156

FWCI:

Cites: 6

Cited by:

Related to: 10