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Solder Fatigue Life Prediction Method Considering Intermetallic Compound Growth

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11040800

Authors: Yikang Wang, Xiaopeng Wu, Jiahao Hou, Can Liu, Yintang Yang

Institution: Xidian University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411799168

FWCI:

Cites: 6

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Related to: 10