Work

Impact of Cross-Sectional Current Crowding on Electromigration in Interconnects

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11040808

Authors: Yichen Wen, Shuying Wang, Xiaoman Yang, Hai-Bao Chen, Maokun Wu, Runsheng Wang, Zhigang Ji, Ru Huang

Institutions: Shanghai Jiao Tong University, Peking University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411799198

FWCI:

Cites: 11

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Related to: 10