Work

A Fan-Out Wafer-Level Packaging-Based THz Communication Transceiver System for High-Speed Chip-to-Chip Wireless Interconnect Applications

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11041162

Authors: Si Rui Liu, Ya Fei Wu, Zong Rui He, Yu Jian Cheng, Yang Chai

Institutions: University of Electronic Science and Technology of China, Hong Kong Polytechnic University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G6975707325

OpenAlex ID: W4411799241

FWCI:

Cites: 6

Cited by:

Related to: 10