Cryogenic sEKV Compact Model Applied to 22 NM FDSOI Enabling Low-Temperature Circuit Simulation
Year: 2025
Type: conference-paper
Institution: École Polytechnique Fédérale de Lausanne
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4411799403
