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A 1.8TB/s HBM Heterogeneously Integrated GPU Design Exploring 2.5D Packaging Technology

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11041033

Authors: Shuang Wang, Weiliang Chen, Xueqing Li, Chen Jiang, Huazhong Yang

Institution: Tsinghua University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4411799416

FWCI:

Cites: 6

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Related to: 10