Work

Heterogeneous Integration of Compound Semiconductor Materials and Devices by Ion-Cutting Technique

Year: 2025

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm61175.2025.11040187

Authors: Tiangui You, Tian Liang, Jiaxin Ding, Jialiang Sun, Shangyu Yang, Xin Ou

Institutions: Chinese Academy of Sciences, Shanghai Institute of Microsystem and Information Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

Award: G6856726986

OpenAlex ID: W4411799663

FWCI:

Cites: 18

Cited by:

Related to: 10