Manufacturing Challenges and Signal Integrity Considerations in High-Speed Rigid-Flex PCB Design
Year: 2025
Type: conference-abstract
Authors: Kaisheng Hu, Laila Salman, Shuhui Deng
Institutions: Ciena (Canada), Ansys (Canada)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4411950308