Bis‐Imidazole Derivative as Latent Curing Agent for One‐Component Epoxy Resin System with Excellent Comprehensive Performance
Year: 2025
Type: article
Abstract: One‐component epoxy resins (OCERs) are widely used for simplified processing, prolonged stability, and enhanced performance. This study synthesizes a novel bis‐imidazole latent curing agent (PBMM) via addition reaction of 2‐formylimidazole and m‐phenylenediamine, structurally confirmed by FT‐IR and NMR. The PBMM/E‐51 system demonstrated optimal curing performance at a mass ratio of 15:100 (curing agent to resin), as determined via dynamic gel time analysis. Differential scanning calorimetry (DSC) was employed to reveal the curing parameters. The optimal curing conditions for PBMM/E‐51 comprise a gelation temperature of 125.6 °C, a curing temperature of 148.2 °C, and a post‐curing temperature of 151.8 °C. Kissinger and Flynn–Wall–Ozawa models established a first‐order kinetic equation. Thermal and mechanical performance testing showed that the cured material possesses a tensile strength of 45.74 MPa, an elastic modulus of 684.64 MPa, an elongation at break of 2.15%, a thermal decomposition temperature of 388 °C, a maximum loss factor (tanδ) of 0.49, a glass transition temperature of 178 °C, a storage modulus (E) of 310.46 MPa, and a cross‐linking density of 25857.49 mol/m 3 . The system maintained 9‐day latency at room temperature, resolving the reactivity‐stability trade‐off in latent curing agents. These findings advance high‐performance OCERs design through balanced processability and thermomechanical properties.
Source: ChemistrySelect
Authors: Meitong Zhou, Dapeng Zhang, Yan Song, Hui Liu, Junfeng Miao, Linglan Li
Institutions: Wuhan Institute of Technology, Hubei University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Funder: Wuhan Institute of Technology
OpenAlex ID: W4412119464