Work

Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding

Year: 2025

Type: article

Source: Nano Letters

DOI: 10.1021/acs.nanolett.5c02448

Authors: Chuan He, Kaiyu Mu, Jingzhuo Zhou, Xinyi Dong, Chunlin Pang, Xingya Wu, Sheng-Jye Cherng, Chih-Chun Chung, Yu-Ting Huang, Yang Lu, Shien-Ping Feng

Institutions: City University of Hong Kong, University of Hong Kong

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: City University of Hong Kong, Research Grants Council, University Grants Committee, Innovation and Technology Commission, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G1068257985, G3967008046, Development of Thermally Instable Nanograined Cu and Thermally Stable Composite Cu For 3DIC Stacking And Advanced Electronic Packaging Applications, G8518669907

OpenAlex ID: W4412364944

FWCI: 1.813

Cites: 35

Cited by: 8

Related to: 10