Work

Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation

Year: 2025

Type: article

Abstract: Effective characterization of creep properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloy is of great significance for improving the service reliability of electronic interconnection solder joint and increasing the lifetime of electronic products. The elastic and creep properties of SAC305 were investigated by uniaxial tensile and creep tests under different temperatures and stress levels, from which the elastic modulus, creep stress exponent and activation energy of SAC305 were determined. Through EBSD test the microstructure information of SAC305 was obtained, and a crystal plasticity model based on dislocation density evolution, containing the β-Sn and eutectic regions, was established to study the creep deformation mechanism of SAC305. From the strain distribution, operation of slip systems and loading direction, the related microscopic deformation characteristics of creep of SAC305 dependent on temperatures and stress were clarified. The verified crystal plasticity model allows the further understanding of micro-scale deformation behaviour and the guidance of texture optimization for solder alloy.

Source: Materials & Design

DOI: 10.1016/j.matdes.2025.114406

Authors: Yuhong Ma, Dan Zhao, Erqiang Liu, Xuexia Yang, Gesheng Xiao, Xuefeng Shu

Institutions: Taiyuan University of Technology, Taiyuan University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $3,650

Funder: National Natural Science Foundation of China