Work

Investigation of the removal mechanism of unidirectional C/SiC under scratching by single diamond grain

Year: 2025

Type: article

Source: Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture

DOI: 10.1177/09544054251350738

Authors: Lifeng Zhang, Zixu Wang

Institution: Civil Aviation University of China

Language: English

Topic: Advanced machining processes and optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Central University Basic Research Fund of China

OpenAlex ID: W4412478662

FWCI:

Cites: 32

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Related to: 10