Work

Multifunctional Shuttle for Processing Small Diameter and Ultra-Thin Semiconductor Wafers

Year: 2025

Type: article

Source: Mechanics of Solids

DOI: 10.1134/s0025654424605226

Authors: N. A. Djuzhev, E. E. Gusev, M. Y. Fomichev, P. S. Ivanin, I. V. Kushnarev, V. A. Bespalov

Institution: National Research University of Electronic Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412496689

FWCI:

Cites: 28

Cited by:

Related to: 10