Work

Infrared Thermal Imaging Detection and Image Segmentation of Micro-Crack Defects in Semiconductor Silicon Wafer Scanned by Laser

Year: 2025

Type: article

Source: Russian Journal of Nondestructive Testing

DOI: 10.1134/s1061830925600297

Authors: Qingju Tang, Bo Fang, Zhuoyan Gu, Vladimir Vavilov, Arsenii Chulkov, Guipeng Xu, Zhibo Wang, Hongru Bu

Institutions: Heilongjiang University of Science and Technology, Tomsk Polytechnic University

Language: English

Topic: Thermography and Photoacoustic Techniques

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412497077

FWCI: 2.3

Cites: 4

Cited by: 7

Related to: 10