Inhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu
Year: 2025
Type: article
Source: Journal of Electronic Packaging
Authors: Kanghun Kim, Yonghwan Kim, Won Young An, Yujin Chang, Seon Jae Hwang, Jonghyock Park, Minkyu Kang, Sungho Cho, Dasom Kim, Yuanzhe Piao
Institution: Seoul National University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4412599980