Work

A 3D Heterogeneously Integrated Power Amplifier Module using BiCMOS and RF SOI CMOS Technologies for 5G Applications

Year: 2025

Type: conference-paper

Source: Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium

DOI: 10.1109/rfic61188.2025.11082897

Authors: Antoine Le Ravallec, Sébastien Sadlo, David Gaidioz, Christophe Arricastres, Romain Coffy, Frédéric Paillardet, Olivier Noblanc

Institution: STMicroelectronics (France)

Language: English

Topic: Advanced Power Amplifier Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412624627

FWCI:

Cites: 20

Cited by:

Related to: 10