Work

AOBL-PSO-BPNN-based electrical and thermal performance prediction of TSV-based 3D inductor

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology and Artificial Intelligence (ETAI)

DOI: 10.1117/12.3068209

Authors: Weihua Fan, Guoliang Li, Guangbao Shan

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412626796

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