Work

Research on Integration of Photonic and Electronic Chips Based on Glass Interposer (Invited)

Year: 2024

Type: conference-paper

Source: IEEE Region 10 Conference (TENCON)

DOI: 10.1109/tencon61640.2024.10902775

Authors: Wanyi Yan, Jin Zhao, Yongjian Chen, Zhuliang Lin, Dan Zhang, Daquan Yu

Institutions: Xiamen University, Beijing University of Technology

Language: English

Topic: Photonic and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G2625490458

OpenAlex ID: W4412673259

FWCI: 2.418

Cites: 11

Cited by: 3

Related to: 10