Work

Microbial decontamination, texture, and color enhancement of chickpeas and sesame seeds using “Intensification of Vaporization by Decompression to Vacuum”

Year: 2025

Type: article

Abstract: Food contamination poses serious challenges to public health and economy in the global food sector, particularly for minimally processed seeds. The inherent microbial load of chickpeas and sesame seeds compromises their safety, shelf-life, and suitability for further processing. While chemical treatments are often restricted due to hazardous residues, conventional thermal treatments can impair sensory quality. This study investigated the application of “Intensification of Vaporization by Decompression to Vacuum” (IVDV) on chickpeas and sesame seeds, focusing on microbial decontamination as well as improvements in texture and color, three essential aspects in seed-based food processing. The process was optimized using Response Surface Methodology, with processing time and steam pressure as the main variables. Results showed that IVDV induced microbial log reductions exceeding 8 in chickpeas and 4.5 in sesame seeds, in addition to textural modifications that are beneficial for processing: it reduced chickpea hardness and ensured moderate hardness in partially roasted sesame seeds. These physical changes were accompanied by a desirable lighter color. Although primarily developed for microbial inactivation, IVDV yielded notable changes in seed texture, potentially enhancing subsequent processes such as boiling, roasting, and grinding. These findings highlight IVDV as a novel, clean-label alternative, combining effective decontamination with improved technological functionality. • IVDV achieves significant microbial reduction in chickpeas and sesame seeds. • IVDV enables HTST-type treatment for improved seed safety. • IVDV enhances texture, easing chickpea and sesame seed processing. • IVDV preserves organoleptic quality of minimally processed seeds. • IVDV is validated as a scalable, rapid, and cost-efficient decontamination method.

Source: LWT

DOI: 10.1016/j.lwt.2025.118230