Work

Direct Electroplating of Cu on Insulators with WO3 Film as Conductive Layer

Year: 2025

Type: article

Source: The Journal of Physical Chemistry C

DOI: 10.1021/acs.jpcc.5c02273

Authors: Yoichi Obinata, Masahiro Shimizu, Susumu Arai

Institutions: Shinshu University, Nagano Prefecture General Industrial Technology Center

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4412865195

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Cites: 41

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Related to: 10