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Multiscale simulation study on the mechanical, electrical, and thermal properties of ZnSb semiconductor

Year: 2025

Type: article

Source: Journal of Materials Chemistry C

DOI: 10.1039/d5tc01764e

Authors: Shihui Chen, Hanwen Yang, Guang Yang, Minghui Cheng, Zipei Zhang, Zhangfeng Wu, Jianping Lin

Institutions: Key Laboratory of Functional Materials and Applications of Fujian Province, Xiamen University of Technology

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Fujian Province

Awards: G2862523499, Zn4Sb3类液态特性及全固态相变存储研究

OpenAlex ID: W4412885709

FWCI:

Cites: 32

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