Management optimization of temperature and pressure drop inside multi-core 3D integrated circuits with microchannels
Year: 2025
Type: article
Source: Thermophysics and Aeromechanics
Authors: P. Z. Chen, Z. L. Pan
Institution: South China Normal University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4412932304