A 77 fJ/Bit 8 Gbps Low-Latency Self-Timed Die-to-Die Link for 2.5D and 3D Interconnect in 3nm
Year: 2025
Type: conference-paper
Authors: Brian Zimmer, Stephen G. Tell, C. Thomas Gray
Institution: Nvidia (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4412963777