Work

Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies

Year: 2025

Type: conference-paper

DOI: 10.23919/vlsitechnologyandcir65189.2025.11075029

Authors: S. Nguyen, H. Huang, A. Jog, M. Shoudy, N. Lanzillo, K. Luedders, T. Cabrera, Y. Yao, D. Metzler, C. Meagher, Y. Mignot, T. Nogami, M. Silvestre, A. Simon, L. Wangoh, K. Motoyama, C. Penny, D. Edelstein, K. Choi, S. Ghosh, V. Narayanan, A. Dutta, S. Choi

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4412964309

FWCI: 5.041

Cites: 4

Cited by: 1

Related to: 10