Work

Fully Heterogeneous and Monolithic 3D Integrated RF Platform with III-V HEMTs on Si CMOS for Next-Generation Wireless Communication Systems

Year: 2025

Type: conference-paper

DOI: 10.23919/vlsitechnologyandcir65189.2025.11075062

Authors: Jaeyong Jeong, Jeong-Taek Lim, Yoon-Je Suh, Nahyun Rheem, Chan Jik Lee, Bong Ho Kim, Joon Pyo Kim, Jongmin Kim, Jongwon Lee, Choul-Young Kim, Sanghyeon Kim

Institutions: Korea Advanced Institute of Science and Technology, Chungnam National University, Korea Advanced Nano Fab Center

Language: English

Topic: Radio Frequency Integrated Circuit Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Research Foundation of Korea

Award: G4918103570

OpenAlex ID: W4412964858

FWCI:

Cites: 3

Cited by:

Related to: 10