Work

Investigation of Post-Bonding Die Stretching in Die-to-Wafer Hybrid Bonding

Year: 2025

Type: conference-paper

DOI: 10.23919/vlsitechnologyandcir65189.2025.11074786

Authors: Yinan Lu, Benedikt Pressl, Ke Zheng, Liu Jiang, Ying W Wang, Hannes Kostner, Chris Scanlan, Raymond Hung, El Mehdi Bazizi

Institutions: Applied Materials (United States), Applied Materials (Singapore)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4412964930

FWCI: 4.641

Cites:

Cited by: 2

Related to: 10