A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow
Year: 2025
Type: conference-paper
Authors: Yi Gao, Zongwei Wang, Lin Bao, Haisu Zhang, Jingwei Sun, Ruiqing Xie, Ling Liang, Yimao Cai
Institution: Peking University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4412965114